| Specification | Details & Options | Notes/Applications | | :--- | :--- | :--- | | | JEDEC eMMC 5.1 | Supports high-speed HS400 mode for optimal performance. | | Capacities | 4GB to 128GB | Common options: 4GB (wearables), 64GB (industrial), 128GB (high-end embedded). | | Flash Memory Type | pSLC, MLC, TLC | pSLC (max endurance), MLC (balanced), TLC (high density, cost-effective). | | Performance (Read/Write) | Varies by model: 160-310 MB/s Read, 19-170 MB/s Write | Higher performance models (up to 310 MB/s read) are available for demanding applications. | | Package Dimensions | 11.5x13mm (Standard) , 9x7.5mm (Compact) | The compact package area is 43.5% of the standard package, ideal for tight spaces. | | Operating Temp. | -25°C to +85°C (Industrial) | Ensures reliable operation in automotive and outdoor industrial environments. | | Key Features | LDPC ECC, SMART, pSLC | LDPC doubles data correction; SMART enables health monitoring. | | Wearable Power (Idle/Sleep) | VCCQ: 110uA, VCC: 15uA | Ultra-low power modes maximize battery life in portable devices. |
The Mk eMMC Plus V3.1 is specifically valued for its ability to service budget and mid-range devices powered by Qualcomm Snapdragon and MediaTek (MTK) chipsets where standard USB debugging or EDL modes are blocked. Common Supported Models
The Mk Emmc Plus V3.1 is primarily deployed for data recovery and device recovery scenarios where the device cannot boot into standard Fastboot, EDL (Emergency Download), or Recovery modes. Mk Emmc Plus V3.1
When removing shields to find ISP test points, use low-temperature alloy paste and targeted hot air to avoid shifting surrounding power management ICs (PMICs).
When devices are locked with patterns, PINs, or FRP (Factory Reset Protection) and standard recovery menus are inaccessible, the tool can selectively format only the user data or persistent configuration sectors without altering system system files. Dead Boot Repair | Specification | Details & Options | Notes/Applications
The V3.1 revision introduces hardware modifications aimed at preventing common failure points during long read/write cycles:
High-speed data transfer is sensitive to interference. Always use the short, shielded USB cable provided with the unit. Conclusion | | Performance (Read/Write) | Varies by model:
The leap to version 3.1 wasn't just cosmetic. This version addressed several "noise" issues found in older ISP adapters.
+-------------------------------------------------------+ | Host Computer | | (MK eMMC Plus Software Suite) | +-------------------------------------------------------+ | [ USB Cable ] | v +-------------------------------------------------------+ | MK eMMC Plus V3.1 Box | | (Voltage Regulation & Protocol Bridging) | +-------------------------------------------------------+ | [ ISP Pinout / Socket ] | v +-------------------------------------------------------+ | Target eMMC Chip | | (CLK, CMD, DATA0, VCC, VCCQ) | +-------------------------------------------------------+ Core Capabilities and Engineering Features 1. Direct ISP Pinout Operations
Whether you are recovering precious memories from a dead phone or refurbishing boards for resale, the V3.1 provides the precision and power necessary to get the job done.